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lite-on dcc release lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto through hole lamp product data sheetLTL27KGEKJ-022A spec no.: ds20-2013-0317effective date: 02/12/2015revision: - bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4
1 / 10 part no. : ltl 27kgekj - 0 2 2a bns - od - fc002/a4 through hole lamp ltl 27kgekj - 0 2 2a through hole lamp ltl27kgekj - 0 2 2a rev description by date p 0 01 preliminary spec (rdr - 20131553 - 01 ) norah 11/ 2 5 /201 3 above data for pd and customer tracking only - nppr received and upload on opnc sasipan 12/03/2013
2 / 10 part no. : ltl 27kgekj - 0 2 2a bns - od - fc002/a4 through hole lamp ltl 27kgekj - 0 2 2a 1. description through - hole leds are offered in a variety of packages such as 3mm, 4mm, 5mm , rectangular and cylinder which are suitable for all applications requiring status indication. there are 3 types of technology base for our leds lamps. gap based technologies for low intensity output requirements; allngap and ingan technologies for high brightness. several intensity choices are available in each color for design flexibility. 1 . 1. features ? pb free and rohs compliant ? halogen free product (cl < 900 ppm, br < 900 ppm, and cl + br < 1500 ppm ) ? long life solid state reliability ? low power consumption ? i.c. compatible ? alingap red / yellow green & white diffused lens 1.2 . applications ? communication ? computer ? consumer ? home appliance ? industrial 2 . outline dimensions notes : 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25mm (.010") unless otherwise noted. 3. protruded resin over edge is 0.1mm(.02") max and depressed resin under edge is 0.5mm(.02") max. lead spacing is me asured where the leads emerge from the package. 4. specifications are subject to change without notice.
3 / 10 part no. : ltl 27kgekj - 0 2 2a bns - od - fc002/a4 through hole lamp ltl 27kgekj - 0 2 2a 3. absolute maximum ratings at ta = 25 c parameter red yellow green unit power dissipation 130 130 mw peak forward current (1/10 duty cycle, 0.1ms pulse w idth) 100 100 ma continuous forward current 50 50 ma operating temperature range - 40 c to + 85 c storage temperature range - 40 c to + 100 c lead soldering temperature [ 2.0 mm(. 787 ") from body] 260 c for 5 seconds max. 4. electrical / optical characteri stics at ta=25 c parameter symbol color min. typ. max. unit test condition luminous intensity iv red yellow green 70 70 125 125 180 180 mcd if = 50ma note 1,4 viewing angle 21/2 red yellow green - 120 - deg note2 (fig.6) peak wavelength p red yellow green - 632 575 - nm measurement @peak (fig.1) dominant wavelength d red yellow green - 625 574 - nm if = 50ma note 3 spectral line half - width ? red yellow gree n - 20 15 - nm forward voltage vf red yellow green - 2.15 2.15 2.6 2.6 v if = 50ma note: 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie eye - response curve. 2. 1/2 is the off - axis angle at which the luminous intensity is half the axial luminous intensity. 3. iv classification code is marked on each packing bag. 4. the dominant wavelength, d is derived from the cie chromaticity diagram and represents the single wavelength which define s the color of the device. 5. the iv guarantee should be added 30% .
4 / 10 part no. : ltl 27kgekj - 0 2 2a bns - od - fc002/a4 through hole lamp ltl 27kgekj - 0 2 2a 5. typical electrical / optical characteristics curves (25 c ambient temperature unless otherwise noted)
5 / 10 part no. : ltl 27kgekj - 0 2 2a bns - od - fc002/a4 through hole lamp ltl 27kgekj - 0 2 2a 6. taping features * compatible with radial lead automatic insertion equipment. * most ra dial lead plastic lead lamps available packaged in tape and folding. * 5mm (0.197") formed lead and 2.54mm (0.1") straight lead spacing available. * folding packaging simplifies handling and testing . * reel packaging is available by removing suffix a on option. package dimensions specification item symbol minimum maximum mm inch mm inch tape feed hole diameter d 3.8 0.149 4.2 0.165 component lead pitch f 2.3 0.091 3.0 0.118 front to rear deflection h -- -- 2.0 0.078 feed hole to bottom of co mponent h1 25.5 1.004 26.5 1.043 feed hole to overall component height h2 31.3 1.232 32.9 1.295 lead length after component height l w0 11.0 0.433 feed hole pitch p 12.4 0.488 13.0 0.511 lead location p1 4.4 0.173 5.8 0.228 center of component locat ion p2 5.05 0.198 7.65 0.301 total tape thickness t -- -- 0.90 0.035 feed hole location w0 8.5 0.334 9.75 0.384 adhesive tape position w2 0 0 3.0 0.118 tape width w3 17.5 0.689 19.0 0.748
6 / 10 part no. : ltl 27kgekj - 0 2 2a bns - od - fc002/a4 through hole lamp ltl 27kgekj - 0 2 2a 7. packing spec. total 3 ,0 00pcs per inner carton 10 inner car tons per outer carton t otal 3 0 ,000 pcs per outer carton in every shipping lot, only the last pack will be non - full packing
7 / 10 part no. : ltl 27kgekj - 0 2 2a bns - od - fc002/a4 through hole lamp ltl 27kgekj - 0 2 2a 8 . bin table specification bin code luminous intensity (yellow green) unit : mcd @50ma bin code luminous intensity (red) unit : mcd @50ma min. max. min. max. e 70 110 e 70 110 f 110 140 f 110 140 g 140 180 g 140 180 note: tolerance of each bin limit is 30 %
8 / 10 part no. : ltl 27kgekj - 0 2 2a bns - od - fc002/a4 through hole lamp ltl 27kgekj - 0 2 2a 9 . cautions 9 . 1. application this led lamp is good for application of indoor and outdoo r sign, also ordinary electronic equipment. 9 . 2. storage the storage ambient for the leds should not exceed 30c temperature or 70% relative humidity. it is recommended that leds out of their original packaging are used within three months. for extended s torage out of their original packaging, it is recommended that the leds be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 9 . 3. cleaning use alcohol - based cleaning solvents such as isopropyl alcohol to cle an the leds if necessary. 9 . 4. lead forming & assembly during lead forming, the leads should be bent at a point at least 3mm from the base of led lens. do not use the base of the lead frame as a fulcrum during forming. lead forming must be done before sol dering, at normal temperature. during assembly on pcb, use minimum clinch force possible to avoid excessive mechanical stress. 9 . 5. soldering when soldering, leave a minimum of 2 mm clearance from the base of the lens to t he soldering point. dipping th e lens into the solder must be avoided. do not apply any external stress to the lead frame during sol dering while the led is at high temperature. r ecommended soldering conditions : soldering iron wave soldering temperature soldering time position 350c max. 3 seconds max. (one time only) no closer than 2 mm from the base of the epoxy bulb pre - heat pre - heat time solder wave soldering time dipping position 100c max. 60 seconds max. 260c max. 5 seconds max. no lower than 2 mm from the base of the epoxy bulb note: excessive soldering temperature and/or time might result in deformation of the led lens or catastrophic failure of the led. ir reflow is not suitable process for through hole type led lamp product. 9 . 6. drive meth od an led is a current - operated device. in order to ensure intensity uniformity on multiple leds connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each led as s hown in circuit a below. circuit model ( a ) circuit model ( b ) (a) recommended circuit (b) the brightness of each led might appear different due to the diff erences in the i - v characteristics of those leds. led led
9 / 10 part no. : ltl 27kgekj - 0 2 2a bns - od - fc002/a4 through hole lamp ltl 27kgekj - 0 2 2a 9 .7. esd (electrostatic discharge) static electricity or power surge will damage the led. suggestions to prevent esd damage: ? use a conductive wrist band or anti - electrostatic glove when handling these le ds ? all devices, equipment, and machinery must be properly grounded ? work tables, storage racks, etc. should be properly grounded ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic lens as a result of fric tion between leds during storage and handing suggested checking list : training and certification 9 .7. 1 .1 . everyone working in a static - safe area is esd - certified? 9 .7.1. 2. training records kept and re - certification dates monitored? static - safe works tation & work areas 9 .7.2.1 . static - safe workstation or work - areas have esd signs? 9 .7. 2. 2. all surfaces and objects at all static - safe workstation and within 1 ft measure less than 100v? 9 .7.2. 3. all ionizer activated, positioned towards the units? 9 .7.2. 4. each work surface mats grounding is good? personnel grounding 9 .7.3.1 . every person (including visitors) handling esd sensitive (esds) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 9 .7.3.1 . if conductive footwear used, conductive flooring also present where operator stand or walk? 9 .7.3.2 . garments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 9 .7.3.3 . every wrist strap or heel strap/conductive shoes checked daily and result recorded for all dls? 9 .7.3.4 . all wrist strap or heel strap checkers calibration up to date? note: *50v for blue led. device handling 9 .7.4. 1. every esds items identified by eia - 471 labels on item or packaging? 9 .7.4. 2. all esds items completely inside properly closed static - shielding containers when not at static - safe workstation? 9 .7.4. 3. no static charge generators (e.g. plastics) inside shielding containers with esds items? 9 .7.4. 4. all flexible co nductive and dissipative package materials inspected before reuse or recycle? others 9 .7.5. 1. audit result reported to entity esd control coordinator? 9 .7.5. 2. corrective action from previous audits completed? 9 .7.5. 3. are audit records comple te and on file?
10 / 10 part no. : ltl 27kgekj - 0 2 2a bns - od - fc002/a4 through hole lamp ltl 27kgekj - 0 2 2a 10 . reliability test classification test item test condition sample size reference standard endurance test operation life ta = u nder room t emperature if = per datasheet maximum drive current test time= 1000hrs 22 pcs (cl=90% ; ltpd= 10 %) mil - std - 750d:1026 (1995) mil - std - 883g:1005 (2006) high temperature high humidity storage ta = 60 c rh = 90 % test time= 24 0hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 202g:103b (2002) jeita ed - 4701:100 103 (2001) high temperature storage ta= 105 5 c test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1031 (1995) mil - std - 883g:1008 (2006) jeita ed - 4701:200 201 (2001) low temperature storage ta= - 55 5 c test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) jeita ed - 4701:200 202 (2001) envir onmental test temperature cycling 100 c 25 c - 40 c 25 c 30mins 5mins 30mins 5mins 3 0 cycles 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1051 (1995) mil - std - 883g:1010 (2006) jeita ed - 4701:100 105 (2001) jesd22 - a104c (2005) thermal shock 100 5 c - 30 c 5 c 15mins 15mins 3 0 cycles (<20 secs transfer ) 22 pcs (cl=90%; ltpd=10 %) mil - std - 750d:1056 (1995) mil - std - 883g:1011 (2006) mil - std - 202g:107g (2002) jesd22 - a106b (2004) solder resistance t.sol = 260 5 c dwell time= 101 seconds 3mm from the base of the epoxy bulb 11 pcs (cl=90%; ltpd=18.9 %) mil - std - 750d:2031(1995) jeita ed - 4701: 300 302 (2001) solderability t. sol = 245 5 c dwell time= 5 0.5 seconds (lead free solder, coverage R 95% of the dipped surface) 11 pcs (cl=90%; ltpd=18.9 %) mil - std - 750d:2026 (1995) mil - std - 883g:2003 (2006) mil - std - 202g:208h (2002) ipc/eia j - std - 002 (2004) soldering iron t. sol = 350 5 c dwell time= 3.5 0.5 seconds 11 pcs (cl=90%; ltpd=18.9 %) mil - std - 202g:208h (2002) jeita ed - 4701:300 302 (2001) 1 1 . others the appearance and specifications of the product may be modified for improvement, without prior notice.

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